Invention Grant
- Patent Title: Electronic apparatus and method for manufacturing the same
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Application No.: US14960638Application Date: 2015-12-07
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Publication No.: US10167537B2Publication Date: 2019-01-01
- Inventor: Taiki Uemura , Kozo Shimizu , Seiki Sakuyama
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Fujitsu Patent Center
- Priority: JP2015-006642 20150116
- Main IPC: H05K7/00
- IPC: H05K7/00 ; C22C28/00 ; B23K35/26 ; C22C13/00 ; B23K35/30 ; B23K35/40 ; H01L23/00 ; H05K3/34
Abstract:
An electronic apparatus includes: a first electronic component including a first electrode; solder on the first electrode; and a phase containing In, Ag, and Cu, the phase being dispersed and included in the solder.And a method for manufacturing an electronic apparatus, the method includes: forming solder on a first electrode of a first component, the solder including a phase containing In, Ag, and Cu, the phase being dispersed in the solder.
Public/Granted literature
- US20160212849A1 ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2016-07-21
Information query
