Invention Grant
- Patent Title: Method and device for electroplating in cylindrical geometry
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Application No.: US14783553Application Date: 2014-03-25
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Publication No.: US10167565B2Publication Date: 2019-01-01
- Inventor: Gregory Savidand , Nicolas Loones , Daniel Lincot , Elisabeth Chassaing
- Applicant: ELECTRICITE DE FRANCE , CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE-CNRS-
- Applicant Address: FR Paris FR Paris
- Assignee: ELECTRICITE DE FRANCE,CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE-CNRS-
- Current Assignee: ELECTRICITE DE FRANCE,CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE-CNRS-
- Current Assignee Address: FR Paris FR Paris
- Agency: Drinker Biddle & Reath LLP
- Priority: FR1353249 20130410
- International Application: PCT/FR2014/050703 WO 20140325
- International Announcement: WO2014/167201 WO 20141016
- Main IPC: C25D5/00
- IPC: C25D5/00 ; C25D5/48 ; C25D7/12 ; C25D5/02 ; C25D7/06 ; C25D17/00 ; C25D17/02 ; C25D17/06 ; C25D17/10 ; C25D17/12 ; C25D21/10 ; C25D5/04 ; C25D5/10 ; C25D5/50 ; C25D9/08

Abstract:
A method and device for electrodeposition in cylindrical geometry. A method for electrochemically depositing a thin layer on a flexible substrate, comprising: providing, in an electrolysis bath, a first closed cylinder in a second hollow cylinder, applying the flexible substrate to one of the surfaces chosen from the outer surface of the first cylinder and the inner surface of the second, the flexible substrate forming a first electrode, providing, in the electrolysis bath, a second electrode, and applying a potential difference between the first electrode and the second electrode in order to electrodeposit the thin layer on the flexible substrate.
Public/Granted literature
- US20160083861A1 METHOD AND DEVICE FOR ELECTROPLATING IN CYLINDRICAL GEOMETRY Public/Granted day:2016-03-24
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