Invention Grant
- Patent Title: Wafer carrier having provisions for improving heating uniformity in chemical vapor deposition systems
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Application No.: US13840164Application Date: 2013-03-15
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Publication No.: US10167571B2Publication Date: 2019-01-01
- Inventor: Sandeep Krishnan , William E. Quinn , Jeffery S. Montgomery , Joshua Mangum , Lukas Urban
- Applicant: Veeco Instruments, Inc.
- Applicant Address: US NY Plainview
- Assignee: Veeco Instruments Inc.
- Current Assignee: Veeco Instruments Inc.
- Current Assignee Address: US NY Plainview
- Agency: Patterson Thuente Pedersen, P.A.
- Main IPC: C30B25/12
- IPC: C30B25/12 ; B23P19/04 ; H01L21/687 ; C23C16/458

Abstract:
A wafer carrier and methods of making the same for use in a system for growing epitaxial layers on one or more wafers by chemical vapor deposition. The wafer carrier includes wafer retention pockets recessed in its body. A thermally-insulating spacer is situated at least partially in the at least one wafer retention pocket and arranged to maintain a spacing between the peripheral wall surface and the wafer, the spacer being constructed from a material having a thermal conductivity less than a thermal conductivity of the wafer carrier such that the spacer limits heat conduction from portions of the wafer carrier body to the wafer. The wafer carrier further includes a spacer retention feature that engages with the spacer and includes a surface oriented to prevent centrifugal movement of the spacer when subjected to rotation about the central axis.
Public/Granted literature
- US20140261187A1 WAFER CARRIER HAVING PROVISIONS FOR IMPROVING HEATING UNIFORMITY IN CHEMICAL VAPOR DEPOSITION SYSTEMS Public/Granted day:2014-09-18
Information query
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