Invention Grant
- Patent Title: Non-contact temperature sensor
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Application No.: US15120835Application Date: 2015-02-10
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Publication No.: US10168232B2Publication Date: 2019-01-01
- Inventor: Kenzo Nakamura , Masashi Nishiyama , Fumio Matsumoto
- Applicant: MITSUBISHI MATERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Priority: JP2014-035330 20140226
- International Application: PCT/JP2015/000598 WO 20150210
- International Announcement: WO2015/129176 WO 20150903
- Main IPC: G01K7/22
- IPC: G01K7/22 ; G01J5/20 ; G01J5/02 ; G03G15/20

Abstract:
A non-contact temperature sensor is provided, the sensor including: an insulating film, a thin film thermistor portion formed on a front-surface of the insulating film, a pair of comb shaped electrodes formed on the thin film thermistor portion, a pair of pad electrodes formed on the front-surface of the insulating film, a pair of pattern wiring portions, and a pair of lead frames that is adhered to the pair of pad electrodes on the front-surface side of the insulating film, wherein the thin film thermistor portion is formed in a thermistor forming region arranged on the front-end side of the insulating film, the pad electrodes are formed in an electrode forming region arranged on the base-end side of the insulating film, the front-end side of the pair of lead frames is arranged to surround the circumference of the thermistor forming region in a non-contact manner.
Public/Granted literature
- US20160363485A1 NON-CONTACT TEMPERATURE SENSOR Public/Granted day:2016-12-15
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