Invention Grant
- Patent Title: Probe card for high voltage testing
-
Application No.: US15460246Application Date: 2017-03-16
-
Publication No.: US10168359B2Publication Date: 2019-01-01
- Inventor: Chin-Yi Tsai , Chien-Hung Chen
- Applicant: MPI Corporation
- Applicant Address: TW Hsinchu County
- Assignee: MPI Corporation
- Current Assignee: MPI Corporation
- Current Assignee Address: TW Hsinchu County
- Agency: CKC & Partners Co., Ltd.
- Priority: TW105112028A 20160418
- Main IPC: G01R1/067
- IPC: G01R1/067

Abstract:
A probe card includes a wiring board, a top cover, a retractable structure and a probe. The top cover couples with the wiring board and has an air inlet. The retractable structure connects with the top cover and includes a first and a second rings. The first ring has vent holes. A top surface of the first ring and a first bottom surface of the top cover define a homogenized space communicating with the air inlet and the vent holes. The second ring couples with the first ring and has jet holes communicating with the vent holes. Outlets of the jet holes locate on a second bottom surface of the second ring. A first inner sidewall of the first ring and a second inner sidewall of the second ring define a pressure space. The probe connects with the wiring board and extends to the pressure space.
Public/Granted literature
- US20170299629A1 PROBE CARD Public/Granted day:2017-10-19
Information query