Invention Grant
- Patent Title: Testing printed circuit board assembly
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Application No.: US15593811Application Date: 2017-05-12
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Publication No.: US10168383B2Publication Date: 2019-01-01
- Inventor: Mark K. Hoffmeyer , Stephen M. Hugo , Mark J. Jeanson , Matthew S. Kelly
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Monchai Chuaychoo
- Main IPC: G01R31/10
- IPC: G01R31/10 ; G01R31/28

Abstract:
Embodiments of the present invention provide systems and methods for destructive testing of a printed circuit board assembly (PCBA). The PCBA contains embedded components on a printed circuit board within a non-functional area. At least one of these embedded components is susceptible to defects and exposed to conditions that facilitate destructive testing which leads to accelerated measurements. The accelerated measurements on the non-functional area are more representative of variability than measurements on a functional module while providing insights into potential future defects.
Public/Granted literature
- US20180328980A1 TESTING PRINTED CIRCUIT BOARD ASSEMBLY Public/Granted day:2018-11-15
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