A chip package assembly testing system and method for testing a chip package assembly are provided herein. In one example, the testing system includes a robot disposed in an enclosure and having a range of motion operable to transfer a chip package assembly between any of a first queuing station, a second queuing station and a plurality of test stations. The system also includes an automatic identification and data capture (AIDC) device operable to read an identification tag affixed to a carrier disposed in the first and second queuing stations, and a controller configured to control placement of chip package assemblies by the robot in response information obtained from a carrier disposed in at least one of the first and second queuing stations, the predefined test routine of the test processor of the first test station, and the predefined test routine of the test processor of the second test station.