Low fly height in-plane magnetic image sensor chip
Abstract:
Disclosed is a low fly height in-plane magnetic image sensor chip. This sensor chip comprises a silicon (Si) substrate with a pit on the surface, a magnetoresistive sensor, and an insulating layer. The magnetoresistive sensor is located on the bottom surface of the pit in the Si substrate. The insulating layer is located above the magnetoresistive sensor. The magnetic image surface detected during operation is coplanar or parallel with the surface of the Si substrate surface. The input and output ends of the magnetoresistive sensor are connected with leads directly, or bonded with leads through pads, or through a conducting post and pads to form connections. And the flying height of the leads is lower than the height of the surface of the Si substrate. This technical solution has several advantages, such as compact structure, high output signal, and direct contact with the magnetic image.
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