Invention Grant
- Patent Title: Low fly height in-plane magnetic image sensor chip
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Application No.: US15304956Application Date: 2015-04-14
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Publication No.: US10168396B2Publication Date: 2019-01-01
- Inventor: James Geza Deak , Zhimin Zhou
- Applicant: MultiDimension Technology Co., Ltd.
- Applicant Address: CN Zhangjiagang
- Assignee: MultiDimension Technology Co., Ltd.
- Current Assignee: MultiDimension Technology Co., Ltd.
- Current Assignee Address: CN Zhangjiagang
- Agency: Schwegman Lundberg & Woessner, P.A.
- Priority: CN201410156470 20140418
- International Application: PCT/CN2015/076530 WO 20150414
- International Announcement: WO2015/158247 WO 20151022
- Main IPC: G01R33/09
- IPC: G01R33/09 ; G01R33/00 ; G07D7/04 ; H01L43/08 ; H01L43/12

Abstract:
Disclosed is a low fly height in-plane magnetic image sensor chip. This sensor chip comprises a silicon (Si) substrate with a pit on the surface, a magnetoresistive sensor, and an insulating layer. The magnetoresistive sensor is located on the bottom surface of the pit in the Si substrate. The insulating layer is located above the magnetoresistive sensor. The magnetic image surface detected during operation is coplanar or parallel with the surface of the Si substrate surface. The input and output ends of the magnetoresistive sensor are connected with leads directly, or bonded with leads through pads, or through a conducting post and pads to form connections. And the flying height of the leads is lower than the height of the surface of the Si substrate. This technical solution has several advantages, such as compact structure, high output signal, and direct contact with the magnetic image.
Public/Granted literature
- US20170184690A1 LOW FLY HEIGHT IN-PLANE MAGNETIC IMAGE SENSOR CHIP Public/Granted day:2017-06-29
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