Invention Grant
- Patent Title: Integration of bonded optoelectronics, photonics waveguide and VLSI SOI
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Application No.: US15347219Application Date: 2016-11-09
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Publication No.: US10168473B2Publication Date: 2019-01-01
- Inventor: Russell A. Budd , Effendi Leobandung , Ning Li , Jean-Olivier Plouchart , Devendra K. Sadana
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Erik Johnson
- Main IPC: G02B6/12
- IPC: G02B6/12 ; G02B6/122 ; G02B6/42 ; H01L31/0216 ; H01L31/103 ; H01L31/18 ; G02B6/132

Abstract:
An optoelectronic device includes an integrated circuit including electronic devices formed on a front side of a semiconductor substrate. A barrier layer is formed on a back side of the semiconductor substrate. A photonics layer is formed on the barrier layer. The photonics layer includes a core for transmission of light and a cladding layer encapsulating the core and including a different index of refraction than the core. The core is configured to couple light generated from a component of the optoelectronic device.
Public/Granted literature
- US20170123151A1 INTEGRATION OF BONDED OPTOELECTRONICS, PHOTONICS WAVEGUIDE AND VLSI SOI Public/Granted day:2017-05-04
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