Invention Grant
- Patent Title: Device and method for stripping flexible substrate
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Application No.: US15515116Application Date: 2016-04-01
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Publication No.: US10168561B2Publication Date: 2019-01-01
- Inventor: Lu Liu , Mingche Hsieh
- Applicant: Boe Technology Group Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Womble Bond Dickinson (US) LLP
- Priority: CN201510364630 20150626
- International Application: PCT/CN2016/078268 WO 20160401
- International Announcement: WO2016/206434 WO 20161229
- Main IPC: B32B43/00
- IPC: B32B43/00 ; G02F1/1333 ; B32B38/10 ; G02F1/13 ; B23K26/36 ; B32B17/06

Abstract:
It is disclosed a device and method for stripping a flexible substrate. The stripping device comprises: a platform for carrying a base plate on which a flexible substrate is formed; a pressing plate for being pressed onto the flexible substrate; and a laser generator for emitting laser for heating the base plate, so that the flexible substrate is decomposed on a side contacting the base plate and thus stripped; wherein the pressing plate is provided with a negative pressure passage, the pressing plate is provided with a suction mouth which is arranged in a side of the pressing plate facing the platform and which communicates with the negative pressure passage, and the negative pressure passage extracts through the suction mouth a gas which is generated during decomposition of the flexible substrate on a side contacting the base plate.
Public/Granted literature
- US20170212371A1 Device and Method for Stripping Flexible Substrate Public/Granted day:2017-07-27
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