Invention Grant
- Patent Title: Composition for forming interlayer insulating film, interlayer insulating film, method for forming interlayer insulating film pattern, and device
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Application No.: US15469277Application Date: 2017-03-24
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Publication No.: US10168617B2Publication Date: 2019-01-01
- Inventor: Kazuhide Uno
- Applicant: TOKYO OHKA KOGYO CO., LTD.
- Applicant Address: JP Kawasaki-Shi
- Assignee: TOKYO OHKA KOGYO CO., LTD.
- Current Assignee: TOKYO OHKA KOGYO CO., LTD.
- Current Assignee Address: JP Kawasaki-Shi
- Agency: Knobbe Martens Olson & Bear LLP
- Priority: JP2016-073321 20160331
- Main IPC: C09D4/00
- IPC: C09D4/00 ; C09D5/00 ; G03F7/16 ; G03F7/20 ; G03F7/32 ; G03F7/40 ; G03F7/027 ; G03F7/031 ; G03F7/035 ; G03F7/038 ; H01L21/02 ; C08F220/28 ; C08F222/22 ; H01L21/027 ; H01L21/311

Abstract:
A composition for forming an interlayer insulating film including a polymerizable monomer, an imide compound represented by general formula (z-1), a reaction promoter which promotes the polymerization of the polymerizable monomer and the imide compound, and a polymerization initiator, an interlayer insulating film containing a polymerized product thereof, a method for forming an interlayer insulating film pattern, and a device including the interlayer insulating film on a support. In the formula (z-1), R1 and R2 represent a hydrogen atom or an alkyl group having 1 to 5 carbon atoms. Rz00 represents a divalent organic group containing an aliphatic hydrocarbon group and/or an aromatic hydrocarbon group, Rz01 and Rz02 represent an alkyl group or an alkoxy group, and n1 and n2 are 0 or 1.
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