Invention Grant
- Patent Title: Cooling using adjustable thermal coupling
-
Application No.: US15366799Application Date: 2016-12-01
-
Publication No.: US10168749B2Publication Date: 2019-01-01
- Inventor: Russell S. Aoki , Devdatta P. Kulkarni , Alan W. Tate , Robin A. Steinbrecher , Ralph W. Jensen
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20 ; F28F9/26 ; H05K1/02 ; H05K1/18 ; H01L23/40 ; H01L23/473

Abstract:
Embodiments described herein may include apparatus, system and/or processes to provide an adjustable thermal coupling between cold plate coupled to a first heat source and a liquid-cooled cold plate cooling a second heat source. In embodiments, the adjustable thermal coupling may provide a degree of freedom along an access in accommodating a dimension requirement of the second heat source. Other embodiments may be described and/or claimed.
Public/Granted literature
- US20180157296A1 COOLING USING ADJUSTABLE THERMAL COUPLING Public/Granted day:2018-06-07
Information query