Invention Grant
- Patent Title: Data buffer for multiple DIMM topology
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Application No.: US15792669Application Date: 2017-10-24
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Publication No.: US10168914B2Publication Date: 2019-01-01
- Inventor: Yang Sun
- Applicant: Cisco Technology, Inc.
- Applicant Address: US CA San Jose
- Assignee: CISCO TECHNOLOGY, INC.
- Current Assignee: CISCO TECHNOLOGY, INC.
- Current Assignee Address: US CA San Jose
- Agency: Polsinelli PC
- Main IPC: G11C16/04
- IPC: G11C16/04 ; G06F3/06 ; G06F13/16 ; G11C5/04

Abstract:
Aspects of the embodiments include systems and devices that include a memory controller circuit element, and a printed circuit board (PCB). The PCB can include a memory module element; and a data buffer circuit element, the data buffer circuit element electrically connected to the memory controller circuit element and configured to receive instructions and data from the memory controller circuit element, the data buffer circuit element electrically connected to the memory module circuit element directly or through a socket, the data buffer circuit element configured to transmit instructions and data originated from the memory controller circuit element to the memory module circuit element and transmit data back to the memory controller.
Public/Granted literature
- US20180121093A1 DATA BUFFER FOR MULTIPLE DIMM TOPOLOGY Public/Granted day:2018-05-03
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