An aspect includes coherency management between volatile memory and non-volatile memory in a through-silicon via (TSV) module of a computer system. A plurality of TSV write signals is simultaneously provided to the volatile memory and the non-volatile memory. A plurality of values of the TSV write signals is captured within a buffer of the non-volatile memory corresponding to a data set written to the volatile memory. Storage space is freed within the buffer as the data set corresponding to the values of the TSV write signals stored within the buffer is written to a non-volatile memory array within the non-volatile memory.