Invention Grant
- Patent Title: Node interconnect architecture to implement high-performance supercomputer
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Application No.: US15140034Application Date: 2016-04-27
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Publication No.: US10169288B2Publication Date: 2019-01-01
- Inventor: Evan G. Colgan , Monty M. Denneau , Daniel M. Kuchta
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Ryan, Mason & Lewis, LLP
- Agent L. Jeffrey Kelly
- Main IPC: G06F15/173
- IPC: G06F15/173 ; G06F15/16 ; G06F15/163 ; H04B10/25 ; H04L5/14

Abstract:
Node interconnect architectures to implement a high performance supercomputer are provided. For example, a node interconnect architecture for connecting a multitude of nodes (or processors) of a supercomputer is implemented using an all-to-all electrical and optical connection network which provides two independent communication paths between any two processors of the supercomputer, wherein a communication path includes at most two electrical links and one optical link.
Public/Granted literature
- US20160241340A1 NODE INTERCONNECT ARCHITECTURE TO IMPLEMENT HIGH-PERFORMANCE SUPERCOMPUTER Public/Granted day:2016-08-18
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