A disclosed RF tag includes a substrate and an integrated circuit (IC) package disposed on the substrate. The IC package has an integrated antenna element coupled to circuitry of the IC package. The RF tag also includes an external antenna element of round wire having at least one half turn disposed against two or more surfaces of the IC package. The external antenna element is inductively coupled to the integrated antenna element, and the IC package laterally supports the at least one half turn of the external antenna element.