Invention Grant
- Patent Title: Modular array of vertically integrated superconducting qubit devices for scalable quantum computing
-
Application No.: US15347160Application Date: 2016-11-09
-
Publication No.: US10169714B2Publication Date: 2019-01-01
- Inventor: Jerry M. Chow , Jay M. Gambetta , Mary B. Rothwell , James R. Rozen
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Vazken Alexanian
- Main IPC: H01L29/06
- IPC: H01L29/06 ; G06N99/00 ; H01L25/04 ; H01L39/04 ; H01L39/22 ; H01L39/24 ; H01L27/18
Abstract:
A technique relates to an assembly for a quantum computing device. A quantum bus plane includes a first set of recesses. A readout plane includes a second set of recesses. A block is positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses. A plurality of qubit chips are included where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.
Public/Granted literature
- US20170061317A1 MODULAR ARRAY OF VERTICALLY INTEGRATED SUPERCONDUCTING QUBIT DEVICES FOR SCALABLE QUANTUM COMPUTING Public/Granted day:2017-03-02
Information query
IPC分类:
