Invention Grant
- Patent Title: Reflow enhancement layer for metallization structures
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Application No.: US15794576Application Date: 2017-10-26
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Publication No.: US10170360B2Publication Date: 2019-01-01
- Inventor: Praneet Adusumilli , Alexander Reznicek , Oscar van der Straten
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Daniel P. Morris, Esq.
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L29/40 ; H01L21/768 ; H01L23/532
Abstract:
A reflow enhancement layer is formed in an opening prior to forming and reflowing a contact metal or metal alloy. The reflow enhancement layer facilitates the movement (i.e., flow) of the contact metal or metal alloy during a reflow anneal process such that a void-free metallization structure of the contact metal or metal alloy is provided.
Public/Granted literature
- US20180047625A1 REFLOW ENHANCEMENT LAYER FOR METALLIZATION STRUCTURES Public/Granted day:2018-02-15
Information query
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