Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
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Application No.: US15632449Application Date: 2017-06-26
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Publication No.: US10170374B2Publication Date: 2019-01-01
- Inventor: I-Sheng Chen , Tzu-Chiang Chen , Cheng-Hsien Wu , Chih-Chieh Yeh , Chih-Sheng Chang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L21/8238
- IPC: H01L21/8238 ; H01L27/092 ; H01L29/06 ; H01L29/423 ; H01L29/49 ; H01L29/786 ; H01L21/02

Abstract:
A semiconductor device includes at least one n-channel, at least one p-channel, at least one first high-k dielectric sheath, at least one second high-k dielectric sheath, a first metal gate electrode and a second metal gate electrode. The first high-k dielectric sheath surrounds the n-channel. The second high-k dielectric sheath surrounds the p-channel. The first high-k dielectric sheath and the second high-k dielectric sheath comprise different high-k dielectric materials. The first metal gate electrode surrounds the first high-k dielectric sheath. The second metal gate electrode surrounds the second high-k dielectric sheath.
Public/Granted literature
- US20180277448A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2018-09-27
Information query
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