Invention Grant
- Patent Title: Memory cell with recessed source/drain contacts to reduce capacitance
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Application No.: US15709704Application Date: 2017-09-20
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Publication No.: US10170377B1Publication Date: 2019-01-01
- Inventor: Hui Zang , Min-Hwa Chi
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Amerson Law Firm, PLLC
- Main IPC: H01L21/8239
- IPC: H01L21/8239 ; H01L27/11 ; H01L21/8234 ; H01L29/78 ; H01L29/66 ; H01L21/8238

Abstract:
A method includes forming a device above an active region defined in a semiconducting substrate. The device includes a plurality of gate structures, a spacer formed adjacent each of the plurality of gate structures, and conductive source/drain contact structures positioned adjacent each of the plurality of gate structures and separated from the associated gate structure by the spacer. A first portion of the conductive source/drain contact structures of a subset of the plurality of gate structures is recessed at a first axial position along a selected gate structure of the plurality of gate structures to define a cavity. A selected source/drain contact structure is not recessed. A first dielectric layer is formed in the cavity. A conductive line contacting the selected source/drain contact structure in the first axial position is formed.
Information query
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