Invention Grant
- Patent Title: Backside initiated uniform heat sink loading
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Application No.: US14274191Application Date: 2014-05-09
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Publication No.: US10170391B2Publication Date: 2019-01-01
- Inventor: Scott W. Dickover , Brian M. Kerrigan , Timothy A. Meserth
- Applicant: Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
- Current Assignee: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
- Current Assignee Address: SG Singapore
- Agency: Roberts Mlotkowski Safran Cole & Calderon, P.C.
- Agent Jason Friday; Andrew M. Calderon
- Main IPC: H01L23/40
- IPC: H01L23/40 ; H05K1/02 ; H05K7/20 ; B23P15/26 ; H01L23/433

Abstract:
A backside initiated uniform heat sink loading system includes a system board assembly, a heat sink assembly, a loading plate, and a fastener. The system board assembly includes at least one processing unit. The heat sink assembly is mounted upon the processing unit from a topside of the system board assembly and includes a plurality of tension members that extend through the system board assembly. The loading plate is mounted to the plurality of tension members from a backside of the system board assembly. The fastener engages with the loading plate from the backside and forces the loading plate away from the system board assembly. As a result, the tension members uniformly force the heat sink assembly upon the processing unit to seat the processing unit with the system board assembly and to thermally contact the heat sink assembly with the processing unit.
Public/Granted literature
- US20150327353A1 BACKSIDE INITIATED UNIFORM HEAT SINK LOADING Public/Granted day:2015-11-12
Information query
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