Invention Grant
- Patent Title: Integrated power module
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Application No.: US15210949Application Date: 2016-07-15
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Publication No.: US10170401B2Publication Date: 2019-01-01
- Inventor: Celement Chiu Sing Tse , Peter On Bon Chan , Chi Keung Tang
- Applicant: Mosway Technologies Limited
- Applicant Address: CN Tsuen Wan, Hong Kong
- Assignee: Mosway Technologies Limited
- Current Assignee: Mosway Technologies Limited
- Current Assignee Address: CN Tsuen Wan, Hong Kong
- Agency: Leydig Voit and Mayer
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/31 ; H01L21/56 ; H01L23/367 ; H01L23/373
Abstract:
An integrated power module comprising a power board including at least one power switching device, a driver board including at least one driver for driving a gate of the at least one power switching device, and an interconnection extending across the power board and the driver board mechanically connecting the power board and the driver board together. Included are a lead frame to which the power board and the driver board are mounted, and a package encapsulating the power board and the driver board mounted on the lead frame. Also disclosed is a method for manufacturing the integrated power module.
Public/Granted literature
- US20170018488A1 INTEGRATED POWER MODULE AND MANUFACTURING METHOD THEREOF Public/Granted day:2017-01-19
Information query
IPC分类:
