Embodiments are generally directed to cavity generation for an embedded interconnect bridge utilizing a temporary structure. An embodiment of a package includes a substrate; a silicon interconnect bridge including a plurality of interconnections, the interconnect bridge being embedded in the substrate; and a plurality of contacts on a surface of the substrate, the plurality of contacts being coupled with the plurality of interconnections of the interconnect bridge. The interconnect bridge is bonded in a cavity in the substrate, the cavity being formed by removal of at least one temporary structure from the substrate.