Invention Grant
- Patent Title: Electronic circuit package
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Application No.: US15381379Application Date: 2016-12-16
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Publication No.: US10170431B2Publication Date: 2019-01-01
- Inventor: Kenichi Kawabata , Toshio Hayakawa , Toshiro Okubo
- Applicant: TDK Corporation
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Young Law Firm, P.C.
- Priority: JP2016-079371 20160412
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L23/31 ; H01L21/48 ; H01L23/498 ; H01L21/56 ; H01L23/29 ; H01L23/00
Abstract:
Disclosed herein is an electronic circuit package includes a substrate having a power supply pattern, a first electronic component mounted on a first region of a front surface of the substrate, a mold resin that covers the front surface of the substrate so as to embed the first electronic component therein and has a concave portion above the first region, a magnetic film selectively provided in the concave portion, and a first metal film that is connected to the power supply pattern and covers the mold resin.
Public/Granted literature
- US20170294387A1 ELECTRONIC CIRCUIT PACKAGE Public/Granted day:2017-10-12
Information query
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