Invention Grant
- Patent Title: Insulated circuit board, power module and power unit
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Application No.: US15533245Application Date: 2015-10-13
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Publication No.: US10170433B2Publication Date: 2019-01-01
- Inventor: Shinnosuke Soda , Yohei Omoto , Komei Hayashi , Shinji Tsukamoto , Yasumichi Hatanaka
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Chiyoda-ku
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Chiyoda-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2014-256431 20141218
- International Application: PCT/JP2015/078874 WO 20151013
- International Announcement: WO2016/098431 WO 20160623
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L25/18 ; H01L25/07 ; H01L25/11 ; H01L23/367 ; H01L23/373 ; H01L23/13 ; H01L23/31

Abstract:
An insulated circuit board includes an insulated substrate, a first electrode, and a second electrode. A thin portion is formed in a corner portion, the corner portion being a region occupying, with regard to directions along outer edges from a vertex of at least one of the first and second electrodes in plan view, a portion of a length of the outer edges, and the thin portion has a thickness smaller than that of a region other than the thin portion. The thin portion in at least one of the first and second electrodes has a planar shape surrounded by first and second sides orthogonal to each other as portions of the outer edges from the vertex, and a curved portion away from the vertex of the first and second sides.
Public/Granted literature
- US20170338189A1 INSULATED CIRCUIT BOARD, POWER MODULE AND POWER UNIT Public/Granted day:2017-11-23
Information query
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