Invention Grant
- Patent Title: Semiconductor packages including heat transferring blocks and methods of manufacturing the same
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Application No.: US15635600Application Date: 2017-06-28
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Publication No.: US10170456B2Publication Date: 2019-01-01
- Inventor: Ki Jun Sung , Rae Hyung Jeong
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-si, Gyeonggi-do
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-si, Gyeonggi-do
- Agency: William Park & Associates Ltd.
- Priority: KR1020160173987 20161219
- Main IPC: H01L25/18
- IPC: H01L25/18 ; H01L23/373 ; H01L23/367 ; H01L21/321 ; H01L25/00 ; H01L21/56 ; H01L23/538 ; H01L23/00 ; H01L23/31 ; H01L25/065
Abstract:
A semiconductor package may be provided. The semiconductor package may include a first semiconductor chip and a second semiconductor chip disposed on an interconnection layer. The semiconductor package may include a heat transferring block disposed between the first and second semiconductor chips to be mounted on the interconnection layer. Related methods are also provided.
Public/Granted literature
- US20180175011A1 SEMICONDUCTOR PACKAGES INCLUDING HEAT TRANSFERRING BLOCKS AND METHODS OF MANUFACTURING THE SAME Public/Granted day:2018-06-21
Information query
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