Invention Grant
- Patent Title: Semiconductor memory device and method of forming the same
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Application No.: US15915026Application Date: 2018-03-07
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Publication No.: US10170481B2Publication Date: 2019-01-01
- Inventor: Ying-Chiao Wang , Li-Wei Feng , Chien-Ting Ho , Tsung-Ying Tsai
- Applicant: UNITED MICROELECTRONICS CORP. , Fujian Jinhua Integrated Circuit Co., Ltd.
- Applicant Address: TW Hsin-Chu CN Quanzhou, Fujian Province
- Assignee: UNITED MICROELECTRONICS CORP.,Fujian Jinhua Integrated Circuit Co., Ltd.
- Current Assignee: UNITED MICROELECTRONICS CORP.,Fujian Jinhua Integrated Circuit Co., Ltd.
- Current Assignee Address: TW Hsin-Chu CN Quanzhou, Fujian Province
- Agent Winston Hsu
- Priority: CN201710180914 20170324
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L21/762 ; H01L29/06

Abstract:
A semiconductor memory device and a method of forming the same, the semiconductor memory device includes a substrate, a plurality of bit lines, a gate, a spacer layer and a first spacer. The substrate has a memory cell region and a periphery region, the a plurality of bit lines are disposed on the substrate, within the memory cell region, and the gate is disposed on the substrate, within the periphery. The spacer layer covers the bit lines and a sidewall of the gate. The first spacer is disposed at two sides of the gate, covers on the spacer layer.
Public/Granted literature
- US20180277546A1 SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FORMING THE SAME Public/Granted day:2018-09-27
Information query
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