Invention Grant
- Patent Title: Diamond semiconductor device
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Application No.: US15899752Application Date: 2018-02-20
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Publication No.: US10170561B1Publication Date: 2019-01-01
- Inventor: Mariko Suzuki , Tadashi Sakai
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Minato-ku
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2017-172249 20170907
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/16 ; H01L29/423 ; H01L29/43

Abstract:
In one embodiment, a diamond semiconductor device includes a first diamond semiconductor layer of a first conductivity type which has a main surface, a second diamond semiconductor layer of an i-type or a second conductivity type which is provided on the main surface of the first diamond semiconductor layer, and has a first side surface with a plane orientation of a {111} plane, a third diamond semiconductor layer of the first conductivity type which is provided on the first side surface, and a fourth diamond semiconductor layer of the second conductivity type which is provided on the main surface of the first diamond semiconductor layer and on a side surface of the second diamond semiconductor layer at a side opposite to a side of the third diamond semiconductor layer.
Information query
IPC分类: