Invention Grant
- Patent Title: Semiconductor device
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Application No.: US15740573Application Date: 2016-08-08
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Publication No.: US10170607B2Publication Date: 2019-01-01
- Inventor: Kenji Kouno
- Applicant: DENSO CORPORATION
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Posz Law Group, PLC
- Priority: JP2015-169396 20150828
- International Application: PCT/JP2016/073244 WO 20160808
- International Announcement: WO2017/038389 WO 20170309
- Main IPC: H01L29/739
- IPC: H01L29/739 ; H01L27/04 ; H01L29/861 ; H01L29/868 ; H01L27/06 ; H01L29/08

Abstract:
A semiconductor device has a semiconductor substrate including a first conductivity-type drift layer, a second conductivity-type base layer disposed in a surface layer portion of the drift layer, and a second conductivity-type collector layer and a first conductivity-type cathode layer disposed opposite to the base layer with respect to the drift layer. In the semiconductor substrate, an IGBT region and a diode region are alternately and repetitively arranged. The IGBT region and the diode region are divided by a boundary between the collector layer and the cathode layer. The collector layer is defined as a first collector layer. The semiconductor device includes a second collector layer having a second conductivity-type impurity concentration higher than that of the first collector layer, at a surface of the semiconductor substrate adjacent to the first collector layer and the cathode layer.
Public/Granted literature
- US20180197977A1 SEMICONDUCTOR DEVICE Public/Granted day:2018-07-12
Information query
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