Invention Grant
- Patent Title: Method of forming a semiconductor device
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Application No.: US15971419Application Date: 2018-05-04
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Publication No.: US10170614B2Publication Date: 2019-01-01
- Inventor: Christian Schippel , Alban Zaka , Ignasi Cortes Mayol
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Amerson Law Firm, PLLC
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/66 ; H01L21/762 ; H01L21/265 ; H01L29/45 ; H01L29/06 ; H01L29/167 ; H01L29/08 ; H01L29/10

Abstract:
A method of forming a semiconductor device includes forming a first well and a second well in a substrate, wherein the first well is doped with dopants of a first conductivity type and the second well is doped with dopants of a second conductivity type. A third well is formed within the first well, and a gate structure is formed above the substrate, the gate structure partially overlying at least the first and second wells. A first epi region is formed on the third well, wherein the first epi region is doped with second dopants of the second conductivity type, and a drain region is formed that is electrically coupled to the second well.
Public/Granted literature
- US20180254343A1 METHOD OF FORMING A SEMICONDUCTOR DEVICE Public/Granted day:2018-09-06
Information query
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