Invention Grant
- Patent Title: Manufacturing method of semiconductor memory device
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Application No.: US14735687Application Date: 2015-06-10
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Publication No.: US10170630B2Publication Date: 2019-01-01
- Inventor: Yasuyuki Arai
- Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Fish & Richardson P.C.
- Priority: JP2012-048244 20120305
- Main IPC: H01L21/8239
- IPC: H01L21/8239 ; H01L29/786 ; H01L27/108 ; H01L29/66 ; H01L29/423 ; H01L27/1156

Abstract:
To provide a highly integrated semiconductor memory device. To provide a semiconductor memory device which can hold stored data even when power is not supplied. To provide a semiconductor memory device which has a large number of write cycles. The degree of integration of a memory cell array is increased by forming a memory cell including two transistors and one capacitor which are arranged three-dimensionally. The electric charge accumulated in the capacitor is prevented from being leaking by forming a transistor for controlling the amount of electric charge of the capacitor in the memory cell using a wide-gap semiconductor having a wider band gap than silicon. Accordingly, a semiconductor memory device which can hold stored data even when power is not supplied can be provided.
Public/Granted literature
- US20150357473A1 SEMICONDUCTOR MEMORY DEVICE Public/Granted day:2015-12-10
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