Invention Grant
- Patent Title: Interface apparatus, interface unit, probe apparatus, and connection method
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Application No.: US15760877Application Date: 2016-08-05
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Publication No.: US10170859B2Publication Date: 2019-01-01
- Inventor: Tomoya Endo
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer
- Priority: JP2015-187290 20150924
- International Application: PCT/JP2016/073173 WO 20160805
- International Announcement: WO2017/051625 WO 20170330
- Main IPC: H01R11/30
- IPC: H01R11/30 ; H01R13/631 ; H01R25/00 ; H01R13/502 ; H01R12/70 ; H01R43/26 ; H01R12/73 ; G01R1/073

Abstract:
In an interface apparatus, when a load is applied to a base member and a connector part is pushed onto an external connector, a spring contracts so that an interval between the base member and a holder is reduced. An inclined surface of a coupling member is separated from an inclined surface of the holder so that fixing of the holder by the coupling member is released and the coupling member can move freely inside a hollow section. As a result, the holder and the connector part can move freely in X-Y directions relative to the base member, and a terminal of a connector can be finely adjusted in the X-Y direction, thus being precisely aligned with the external connector.
Public/Granted literature
- US10205279B2 Interface apparatus, interface unit, probe apparatus, and connection method Public/Granted day:2019-02-12
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