Invention Grant
- Patent Title: Composite component and front-end module
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Application No.: US15417652Application Date: 2017-01-27
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Publication No.: US10171059B2Publication Date: 2019-01-01
- Inventor: Seigo Hino
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JP2014-182648 20140908
- Main IPC: H03H7/01
- IPC: H03H7/01 ; H05K7/14 ; H03F3/19 ; H01L25/00 ; H04B1/40 ; H03F3/24 ; H03H9/46 ; H05K1/14 ; H05K1/18 ; H03H9/05 ; H05K1/02

Abstract:
An object is to provide a technique that can reduce the degradation in the characteristics of a transmitting filter by improving heat dissipation characteristics of a composite component having a stack structure. Since a transmitting filter is disposed in or on a first substrate 14, the heat generated in the transmitting filter is efficiently dissipated, for example, to an external module substrate 2 electrically connected to the first substrate 14. It is thus possible to reduce changes in the characteristics of the transmitting filter caused by a temperature rise. Thus, by improving heat dissipation characteristics of a composite component 10 having a stack structure, the degradation in the characteristics of the transmitting filter can be reduced.
Public/Granted literature
- US20170133998A1 COMPOSITE COMPONENT AND FRONT-END MODULE Public/Granted day:2017-05-11
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