Invention Grant
- Patent Title: Camera module with integrated chip-on-board image sensing chip
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Application No.: US15415882Application Date: 2017-01-26
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Publication No.: US10171715B2Publication Date: 2019-01-01
- Inventor: Wei-Chuan Wang , Xin-Lian Cheng , Ting-Yu Lin , Chun-Mei Zhang , Chin-Lian Yeh
- Applicant: ASIA VITAL COMPONENTS CO., LTD.
- Applicant Address: TW New Taipei
- Assignee: ASIA VITAL COMPONENTS CO., LTD.
- Current Assignee: ASIA VITAL COMPONENTS CO., LTD.
- Current Assignee Address: TW New Taipei
- Agency: Jackson IPG PLLC
- Agent Demian K. Jackson
- Main IPC: H04N5/225
- IPC: H04N5/225
Abstract:
A camera module includes a circuit board, a camera device and an image processing chip. An image sensation chip of the camera device is directly integrated with the circuit board by means of chip-on-board (COB) manufacturing process to minify the total volume of the camera module, whereby the camera module can be disposed in a narrow space.
Public/Granted literature
- US20180213129A1 CAMERA MODULE Public/Granted day:2018-07-26
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