Invention Grant
- Patent Title: Solid-state imaging device and electronic device
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Application No.: US15560645Application Date: 2016-03-18
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Publication No.: US10171761B2Publication Date: 2019-01-01
- Inventor: Katsuhiko Hanzawa
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Wolf, Greenfield & Sacks, P.C.
- Priority: JP2015-076732 20150403
- International Application: PCT/JP2016/058649 WO 20160318
- International Announcement: WO2016/158484 WO 20161006
- Main IPC: H04N3/14
- IPC: H04N3/14 ; H04N5/335 ; H04N5/359 ; H04N5/374 ; H04N5/378 ; H04N5/3745

Abstract:
The present technology relates to a solid-state imaging device and an electronic device that enable a reduction in the voltage of an AD conversion circuit. A solid-state imaging device includes: a plurality of pixels; a vertical signal line configured to output a pixel signal of the pixel; and a clipping circuit configured to limit a voltage of the vertical signal line to a predetermined voltage. The clipping circuit includes a transistor configured to generate the predetermined voltage in accordance with a voltage of a gate, and a sample holding circuit configured to hold a reset level of the pixel that is output to the vertical signal line, and input the reset level to the gate of the transistor. The present technology can be applied to a CMOS image sensor, for example.
Public/Granted literature
- US20180098005A1 SOLID-STATE IMAGING DEVICE AND ELECTRONIC DEVICE Public/Granted day:2018-04-05
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