Invention Grant
- Patent Title: Sound pickup device and sound processing device
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Application No.: US15490509Application Date: 2017-04-18
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Publication No.: US10171901B2Publication Date: 2019-01-01
- Inventor: Hideaki Takehisa , Nobuhiro Nambu , Masamichi Yano , Keizo Harada
- Applicant: YAMAHA CORPORATION
- Applicant Address: JP Hamamatsu-shi
- Assignee: YAMAHA CORPORATION
- Current Assignee: YAMAHA CORPORATION
- Current Assignee Address: JP Hamamatsu-shi
- Agency: Rossi, Kimms & McDowell LLP
- Priority: JP2016-084669 20160420
- Main IPC: H04R1/08
- IPC: H04R1/08 ; H04R1/28 ; H04R3/04 ; H04R1/46 ; H04R29/00 ; G10H3/14 ; H04R1/02 ; H04R1/04 ; H04R19/01

Abstract:
A sound pickup device includes: a housing; a mount portion via which the housing is mounted on an object; a sound pickup including a microphone; a first output configured to output a sound signal indicating a sound input to the sound pickup; an installer configured to install the sound pickup on the housing; a sensor configured to detect a vibration transmitted to the housing; and a second output configured to output a vibration signal indicating the vibration detected by the sensor.
Public/Granted literature
- US20170311066A1 SOUND PICKUP DEVICE AND SOUND PROCESSING DEVICE Public/Granted day:2017-10-26
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