A surface mount technology (SMT) device can include an SMT interface on a given side of the SMT device. The SMT interface can include an interface ground plane formed of conductive material. The SMT interface can also include a plurality of signal pads formed of the conductive material. Each signal pad can be encircled by one of a plurality of isolation regions formed from a non-conductive region of the SMT interface. The SMT device is configured for mounting on a printed wiring board (PWB) that includes a board interface having substantially the same shape at the SMT interface.