A wiring board includes a laminate in which at least one first insulating layer containing first insulating particles and a first insulating resin, and at least one second insulating layer containing second insulating particles having a particle size smaller than a particle size of the first insulating particles and a second insulating resin are alternately positioned; a groove for wiring positioned at least on an upper surface of the laminate and including a side surface and a bottom surface; a via hole positioned in the first insulating layer of the laminate; and a wiring conductor positioned in the groove for wiring and in the via hole. The bottom surface of the groove for wiring is positioned in the second insulating layer.