Invention Grant
- Patent Title: Multilayer capacitor and board having the same
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Application No.: US15492447Application Date: 2017-04-20
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Publication No.: US10172238B2Publication Date: 2019-01-01
- Inventor: Ho Sam Choi , Ki Pyo Hong
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2016-0092759 20160721
- Main IPC: H01G4/012
- IPC: H01G4/012 ; H01G4/232 ; H01G4/30 ; H05K1/18 ; H05K1/11 ; H05K3/34

Abstract:
A multilayer capacitor includes a capacitor body including first and second internal electrodes alternately stacked with dielectric layers interposed therebetween. The first and second internal electrodes are exposed at a mounting surface of the capacitor body. The capacitor body includes first and second groove parts at the mounting surface, spaced apart in a length direction of the capacitor body, and contacting exposed portions of the first and second internal electrodes, respectively. The multilayer capacitor includes first and second external electrodes in the first and second groove parts, respectively, and electrically connected to the exposed portions of the first and second internal electrodes, respectively.
Public/Granted literature
- US20180027658A1 MULTILAYER CAPACITOR AND BOARD HAVING THE SAME Public/Granted day:2018-01-25
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