Invention Grant
- Patent Title: Wire bonded electronic devices to round wire
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Application No.: US15427875Application Date: 2017-02-08
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Publication No.: US10172240B2Publication Date: 2019-01-01
- Inventor: Robert Neuman
- Applicant: AUTOMATED ASSEMBLY CORPORATION
- Applicant Address: US MN Lakeville
- Assignee: Automated Assembly Corporation
- Current Assignee: Automated Assembly Corporation
- Current Assignee Address: US MN Lakeville
- Agency: Crawford Maunu PLLC
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L21/56 ; H01L23/31 ; H01L23/498 ; H05K3/32 ; H01L23/00 ; H01L33/48 ; H01L33/54 ; H01L33/62 ; H05K1/18 ; H05K3/34 ; H05K3/28
Abstract:
A disclosed circuit arrangement includes a flexible substrate. A layer of pressure sensitive adhesive (PSA) is directly adhered to a first major surface of the substrate. One or more metal foil pads and electrically conductive wire are attached directly on a surface of the PSA layer. The wire has a round cross-section and one or more portions directly connected to the one or more metal foil pads with one or more weld joints, respectively. An electronic device is attached directly on the surface of the layer of PSA and is electrically connected to the one or more portions of the round wire by one or more bond wires, respectively.
Public/Granted literature
- US20170200694A1 WIRE BONDED ELECTRONIC DEVICES TO ROUND WIRE Public/Granted day:2017-07-13
Information query
IPC分类:
