Invention Grant
- Patent Title: Electronic assembly having a conductive shield and grounding contacts
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Application No.: US15904854Application Date: 2018-02-26
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Publication No.: US10172263B1Publication Date: 2019-01-01
- Inventor: Galen M. Martin
- Applicant: TE CONNECTIVITY CORPORATION
- Applicant Address: US PA Berwyn
- Assignee: TE CONNECTIVITY CORPORATION
- Current Assignee: TE CONNECTIVITY CORPORATION
- Current Assignee Address: US PA Berwyn
- Main IPC: H05K9/00
- IPC: H05K9/00 ; H01R12/58 ; H05K1/02 ; H05K1/11 ; H01R4/26

Abstract:
Electronic assembly includes a printed circuit having a plurality of thru-holes. The electronic assembly also includes a conductive shield having a plurality of sidewalls. The sidewalls define a cavity. Edges of at least some of the sidewalls interface with the printed circuit along a perimeter line. The perimeter line intersects the thru-holes or extends immediately adjacent to the thru-holes. The electronic assembly also includes a plurality of grounding contacts that are each discrete with respect to the conductive shield. Each of the grounding contacts of said plurality includes a pin segment and a wall-engaging segment. The pin segments include compliant pins that are insertable into the thru-holes. The wall-engaging segments are connected to respective sidewalls. The grounding contacts are distributed along the perimeter line and electrically couple the conductive shield to the ground conductor of the printed circuit.
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