Invention Grant
- Patent Title: Housing and electronic device
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Application No.: US15642892Application Date: 2017-07-06
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Publication No.: US10172264B2Publication Date: 2019-01-01
- Inventor: Yoshiaki Hiratsuka , Kai Nojima , Kenji Nagase , Yoshinori Mesaki
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Staas & Halsey LLP
- Priority: JP2016-142988 20160721
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K5/03 ; H05K9/00

Abstract:
A housing includes a first member that has a first conductor, a second member that has a second conductor and cooperates with the first member to accommodate a circuit board on which an electronic element is mounted, inside a space surrounded by the first conductor and the second conductor, and a plurality of connecting elements that are arranged at a predetermined arrangement interval y to fix the second member to the first member.
Public/Granted literature
- US20180027707A1 HOUSING AND ELECTRONIC DEVICE Public/Granted day:2018-01-25
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