A shielding assembly is disclosed, the assembly including at least a board level shield and a heat sink. The assembly may include a board level shield that includes both a lid and a fence, and may also include a thermal interface material, where the assembly may be mounted on a printed circuit board to provide both EMI shielding and thermal management of heat-generating electronic components or heat sources on the circuit board. The heat sink includes at least one pin, and the shield includes at least one complementary perforation relative to the pin, such that an assembled device of the disclosure provides both EMI shielding and thermal management while permitting the transfer of thermal energy via the heat sink pin through the board level shield perforation.