Invention Grant
- Patent Title: Ultrasonic device, ultrasonic probe, ultrasonic diagnostic apparatus, and method of manufacturing ultrasonic device
-
Application No.: US14511324Application Date: 2014-10-10
-
Publication No.: US10172591B2Publication Date: 2019-01-08
- Inventor: Kanechika Kiyose , Toshikazu Uchiyama
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2013-213463 20131011
- Main IPC: A61B8/00
- IPC: A61B8/00 ; B06B1/06 ; A61B8/14 ; A61B8/08

Abstract:
An ultrasonic device includes a substrate, a first piezoelectric body, a second piezoelectric body, and an acoustic matching section. The substrate has a first surface that is a flat surface. The first piezoelectric body is disposed on the first surface of the substrate. The second piezoelectric body is disposed on the first surface of the substrate. The second piezoelectric body has a different thickness from a thickness of the first piezoelectric body as measured from the first surface of the substrate. The acoustic matching section is disposed on the first piezoelectric body and the second piezoelectric body. The acoustic matching section has a first side facing the first piezoelectric body and the second piezoelectric body, and a second side opposite from the first side. A surface of the acoustic matching section on the second side is a flat surface parallel with the first surface of the substrate.
Public/Granted literature
Information query