Method for forming heat-shielding film and heat-shielding film structure
Abstract:
A second heat-shielding film 20 produced by anodizing treatment of both surfaces of pure Al foil with an Al purity equal to or larger than 99.0% is disposed on a surface of a first heat-shielding film 12 that is formed by anodizing treatment of a surface of a combustion chamber configuring component 10 formed from an Al alloy (Al purity of less than 99.0%) as a based material. A heat resistant adhesive is poured from between these heat-shielding films, and the heat resistant adhesive is heated and cured (an intermediate layer 22). Since the second heat-shielding film has low surface roughness Ra of an average of approximately 1.0 μm even in an unpolished state, polishing or the like for the film with an objective of smoothing after bonding of the second heat-shielding film can be omitted. Further, the heat-shielding film structure with a smoothed surface can be provided.
Information query
Patent Agency Ranking
0/0