Invention Grant
- Patent Title: High rigidity interlayers and light weight laminated multiple layer panels
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Application No.: US13781906Application Date: 2013-03-01
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Publication No.: US10173396B2Publication Date: 2019-01-08
- Inventor: Jun Lu
- Applicant: Solutia Inc.
- Applicant Address: US MO St. Louis
- Assignee: Solutia Inc.
- Current Assignee: Solutia Inc.
- Current Assignee Address: US MO St. Louis
- Agent Michelle Bugbee
- Main IPC: B32B17/10
- IPC: B32B17/10 ; B32B7/02 ; B32B27/30
Abstract:
This disclosure is related to the field of polymer interlayers for multiple layer panels and multiple layer panels having at least one polymer interlayer sheet. Specifically, this disclosure is related to the field of high rigidity interlayers and light weight laminated multiple layer panels incorporating high rigidity interlayers.
Public/Granted literature
- US20130236711A1 HIGH RIGITY INTERLAYERS AND LIGHT WEIGHT LAMINATED MULTIPLE LAYER PANELS Public/Granted day:2013-09-12
Information query
