Invention Grant
- Patent Title: Liquid ejecting head, liquid ejecting apparatus, and method for manufacturing liquid ejecting head
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Application No.: US15694125Application Date: 2017-09-01
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Publication No.: US10173424B2Publication Date: 2019-01-08
- Inventor: Yasuhide Matsuo
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2016-183926 20160921; JP2016-227447 20161124
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16

Abstract:
Provided is a liquid ejecting head including: a first substrate in which a space serving as a flow path is formed in a state of having an opening on a surface of one side thereof; and a second substrate which seals the opening from the surface on the one side of the first substrate, divides the flow path, and is made of resin, in which the first substrate and the second substrate adhere to each other via a first adhesive layer which is laminated on the surface on the one side of the first substrate and which is made of a silicone-based adhesive and a second adhesive layer which is laminated on the first adhesive layer and which is made of an epoxy-based adhesive.
Public/Granted literature
- US20180079209A1 LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, AND METHOD FOR MANUFACTURING LIQUID EJECTING HEAD Public/Granted day:2018-03-22
Information query
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