Invention Grant
- Patent Title: Liquid ejecting head, method for manufacturing the same, and liquid ejecting apparatus
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Application No.: US15296523Application Date: 2016-10-18
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Publication No.: US10173429B2Publication Date: 2019-01-08
- Inventor: Masahisa Nawano , Taiki Hanagami , Isamu Togashi
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2015-214959 20151030
- Main IPC: B41J2/165
- IPC: B41J2/165 ; B41J2/16

Abstract:
A liquid ejecting head includes a head body which has a nozzle opening for ejecting a liquid and a first wiping surface to be wiped by a wiper; and a target wiping member which has a second wiping surface to be wiped by the wiper, wherein the head body and the target wiping member are lined up via a gap so as to face in the same direction as the first wiping surface and the second wiping surface, and an elastic member is elastic deformed and held in the gap to block the gap on a side of the first and second wiping surface.
Public/Granted literature
- US20170120599A1 LIQUID EJECTING HEAD, METHOD FOR MANUFACTURING THE SAME, AND LIQUID EJECTING APPARATUS Public/Granted day:2017-05-04
Information query
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