Invention Grant
- Patent Title: Glass substrate package
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Application No.: US15558591Application Date: 2016-03-23
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Publication No.: US10173833B2Publication Date: 2019-01-08
- Inventor: Hiroki Katayama
- Applicant: Nippon Electric Glass Co., Ltd.
- Applicant Address: JP Shiga
- Assignee: NIPPON ELECTRIC GLASS CO., LTD.
- Current Assignee: NIPPON ELECTRIC GLASS CO., LTD.
- Current Assignee Address: JP Shiga
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2015-085130 20150417
- International Application: PCT/JP2016/059216 WO 20160323
- International Announcement: WO2016/167092 WO 20161020
- Main IPC: B65D85/48
- IPC: B65D85/48 ; B65D81/05 ; B65D85/62 ; H01L21/673

Abstract:
Provided is a glass substrate package (1), including a plurality of disc-shaped glass substrates (2) packaged in a box (3), in which the plurality of disc-shaped glass substrates (2) are stacked and packaged in a horizontal posture under a state in which slip sheets (4) are interposed between the plurality of disc-shaped glass substrates (2).
Public/Granted literature
- US20180072489A1 GLASS SUBSTRATE PACKAGE Public/Granted day:2018-03-15
Information query
IPC分类: