Invention Grant
- Patent Title: Joined body joined by chemical bonding at material interface, and joining method for joined body
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Application No.: US14914455Application Date: 2014-08-27
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Publication No.: US10174172B2Publication Date: 2019-01-08
- Inventor: Akira Harada , Hiroyasu Yamaguchi , Akihito Hashidzume , Yoshinori Takashima , Tomoko Sekine , Yuichiro Kobayashi , Masaki Nakahata
- Applicant: Osaka University
- Applicant Address: JP Suita-shi
- Assignee: Osaka University
- Current Assignee: Osaka University
- Current Assignee Address: JP Suita-shi
- Agency: Locke Lord LLP
- Agent James E. Armstrong, IV; Nicholas J. DiCeglie, Jr.
- Priority: JP2013-176128 20130827
- International Application: PCT/JP2014/072488 WO 20140827
- International Announcement: WO2015/030079 WO 20150305
- Main IPC: C08G81/02
- IPC: C08G81/02 ; C08J5/12 ; C12N9/96 ; C09J5/00
Abstract:
The present invention provides a joined body with no risk of detachment from the joining surface without using an adhesive, and a method for producing the joined body. The present invention also provides a reversible joined body that enables control of joining and dissociation, and a method for producing the reversible joined body. In the joined body, a chemical bond is formed between two or more same or different solid-state materials at their contact interfaces by a chemical reaction.
Public/Granted literature
- US20160272768A1 JOINED BODY JOINED BY CHEMICAL BONDING AT MATERIAL INTERFACE, AND JOINING METHOD FOR JOINED BODY Public/Granted day:2016-09-22
Information query
